About Us
The spirit and goal of Arena are to provide a full range of vacuum sealing services for high-end/advanced front-end manufacturing processes of semiconductor industry, TFT, LCD and LED in Taiwan,. In the beginning of Arena, the main business was high-purity rubber material components that are required in the semiconductor front-end process. During this period, Arena combined with many well-known international manufacturers to deepen its roots in Taiwan through strategic alliances and technology transfer.
All the processes and workstations in the new factory are certified by ISO, clean as the basic requirement of work, and are engaged in manufacturing and quality control packaging in a clean room environment to meet the high-level requirements of the industry; Arena established trace back system of quality and product to ensure the rights and interests of customers; Arena adheres to ISO's consistent and strict requirements for quality to establish a quality system of SOP and In Process Inspection to ensure product repeatability and stability.
History & Milestone
2020-Participated in TSMC N3 RDPC(R&D Process Center)/Collaborated with EKK and planned the business for CVD & EPI market.
2019-Expanded aggressively business to China market and successfully certificated by Intel to be the qualified rubber vendor in DaLian.
2018
-Arena`s material of rubber and PEEK passed the test of TSMC N5 process.
2017
-Involved with supply chain of SMIC group, YMTC, HLMC, TI, TSMC in SongJiang and NanJing, HJTC, Nexchip in China and met with equipment manufacturer of China.
2016
-Arena became the third largest rubber supplier of TSMC.
2014
-Co-worked with rubber vendors to develop the next level rubber and got the certification for component of Vigus rubber material.
2012
-Approved by TSMC TELSCCM-Vigus & Certas Dry Etching Machine for nano-process and activated MIT(Made In Taiwan Project) of TSMC Technical Broad.
2011
-Arena penetrate market with our own brand name and activated OEM Approval Vendor Project.
2010
-Gaining over 60% Bonding Slit Valve market share in Taiwan and expanding business to over sea market.
2009
-Approved by TSMC to be a Bonding Slit Valve strategic vendor and at the same time, co-work with international rubber makers to deepen new technology and development.
2008
-Eliminated none rubber business to be a professional high-end rubber manufacturer.
2007
-TSMC activated Localization Project.
2006
-Relocated fab to Hsinchu Industrial Park.
2005
-UMC certificated Arena instrument as qualified critical rubber vendor and activated TSMC Bonding Slit Valve Project.
2004
-Set up rubber lab and research bonding technology.
2003
-Involved with semiconductor filed and LED process kit business and manufactured Heating Jacket for LED and semiconductor front-end application.
2000
-Arena Instrument CO.LTD was reorganized and started operation independently.
1995
-Victor Taichung established Arena Research CO,LTD and transferred MFC(Mass Flow Controller) technology from Lintec and manufactured locally.
